Skip to Primary Navigation Skip to Site Navigation Skip to Main Content All 3M.com Site Map
Abrasives for Electronics Finishing

3M™ CMP Solutions


Our next-generation abrasive technologies give you more production-proven ways to help meet today's most demanding CMP requirements. With pad conditioners for conventional slurry processes and unique fixed abrasives, our products deliver superior planarization, a more stable process and low defect rates.



CMP Solutions Product Families

3M™ Fixed Abrasives for CMP

3M™ Fixed Abrasives for CMP

The proven, high performance alternative to conventional slurries, pads and conditioners lets you polish thousands of wafers between consumable changes.

3M™ Pad Conditioners

3M™ Pad Conditioners

Highly engineered structured abrasive products deliver reliable performance for critical semiconductor CMP applications. 3M™ Diamond Pad Conditioners use deliberate diamond placement and protrusion to produce a consistent finish, with superior diamond retention to reduce scratching.